**16GB DDR4 dual-channel kit | XMP 3600MHz overclocking | RGB lighting |
aluminium heat spreader | lifetime warranty**

Quick Specs

* Achieve faster load times and smoother multitasking with 16GB of DDR4 memory across two matched 8GB modules
* Dominate your games at XMP 3600MHz — simply enable the XMP 3.0 profile in BIOS for instant performance gains
* Experience vivid, customisable RGB lighting that brings your build to life with a powerful light effect across both sticks
* Keep thermals in check with an aluminium alloy heat spreader designed to maintain stable, sustained performance
* Build with confidence — backed by a limited lifetime warranty and selected high-quality ICs for long-term reliability

Built to Push Your Gaming Rig Further

The HIKSEMI Future RGB DDR4 kit is built for gamers and PC builders who demand
both performance and visual impact from their components. Pairing 16GB of
dual-channel DDR4 memory with XMP 3600MHz speeds and vivid RGB lighting, it
delivers the raw throughput your system needs while ensuring your build looks
the part through a tempered glass side panel.

XMP 3600MHz — Serious Speed Without the Complexity

Tired of spending hours tweaking memory timings manually? The Future RGB
supports Intel XMP 3.0, letting you unlock 3600MHz operation with a single
toggle in your motherboard’s BIOS. Built on carefully selected ICs, each module
is tuned for stable, high-bandwidth performance across demanding games, content
creation workloads, and everything in between.

RGB That Commands Attention

Both modules feature a striking RGB light bar along the top edge, casting vivid
colour across your case interior. Whether you prefer a rolling rainbow or a bold
single colour, the lighting effect adds a sense of energy and personality to any
gaming build — and with lighting effect software support noted in the product
imagery, coordinating your setup is straightforward.

Cooler Under Pressure, Built to Last

An aluminium alloy heat spreader wraps each module, drawing heat away from the
ICs during extended sessions. Rated for operation from 0°C to 85°C, the Future
RGB is engineered to remain stable even in thermally demanding cases. Backed by
HIKSEMI’s limited lifetime warranty, this kit is a long-term investment in your
platform.

Features

* 16GB total capacity in a 2x8GB dual-channel kit for improved bandwidth over single-module configurations
* DDR4 UDIMM form factor — compatible with standard desktop DDR4 motherboards (288-pin)
* XMP 3.0 overclock profile enables 3600MHz with a simple BIOS setting
* RGB lighting along the top bar of each module for a vivid in-case lighting effect
* Aluminium alloy heat spreader aids thermal dissipation during sustained workloads
* Selected high-quality ICs for stable, compatible, cost-effective performance
* Rated operating temperature: 0°C to 85°C
* Limited lifetime warranty for long-term peace of mind

Specifications

* Brand: HIKSEMI
* Colour: Black
* Product Weight: 70g x 2
* Product Dimensions (L x W x H): 13.34 x 0.41 x 3.13cm
* Release Year: 2026
* Memory Type: DDR4
* Total Capacity: 16gb
* Kit Configuration: 2x8GB
* Speed: 3600MHz
* Module Form Factor: UDIMM
* Overclock Profile: XMP 3.0
* RGB Lighting: true
* Heat Spreader: true

What’s in the Box

* HIKSEMI Future RGB DDR4 8GB UDIMM – Black x2

Why HIKSEMI

HIKSEMI is a technology brand committed to delivering high-quality storage and
memory solutions that combine performance, stability, and value. Backed by
mature production technology and carefully selected ICs, HIKSEMI products are
built to meet the demands of modern PC builders and gamers who refuse to
compromise on either speed or reliability.